[Event] TechBlick “The Future of Electronics RESHAPED”
The premier conference and exhibition on re-shaping the future of electronics focusing on the topics of printed, flexible, wearable, 3D and in-mold electronics.
The global community from innovators and material suppliers to equipment makers, manufacturers and end users – will all gather here to reshape the future of electronics.
Join us in the Netherlands on 12-13 OCT 2022 at booth 48.
Feel free to contact Pierre Ball and David Lafourcade to plan a meeting!
About us in the medias
The concept of PCB-on-film integration is very innovative as it liberates the flexible hybrid electronics from the linewdith limitations of printed electronics, meaning that one can integrate complex rigid electronics/ICs with printed flexible electronics regardless of the pitch size and complexity of the IC!! This is important because often the printed linewdiths are too wide to support most ICs who have pins with narrow pitches—
Join us in the Netherlands on 12-13 OCT 2022 to hear about this very innovative approach from Pierre Ball and colleagues BeLink Solutions – La Ferté Bernard