Nous sommes présents à l’événement virtuel et en direct « Printed, hybrid, InMold & 3D Electronics » de TechBlick.
Rejoignez-nous pour notre conférence ce jeudi à 19h39 avec Pierre Ball.
Sujet de la conférence:
Industrialization of Printed Electronics technology moving from POC to high volumes.
Printed Electronics technology requires robust industrialization processes to ensure high volume production success.
BeLink Solutions with legacy experience in conventional electronics as well as screen printing for the automotive market has combined both expertises to develop high volumes processes in Printed Electronics.
Our objective is to support Printed Electronics market growth for Automotive, Industrial, Smart Home & Building customers by providing robust and reliable manufacturing processes.